Copper bottom cookware
Copper bottom cookware is the best option available nowadays for those who are looking for a quality cookware. Copper Cookware has tin, aluminum, or stainless steel cookware with a copper core having a layer of metal in between other layers of non-copper or with a copper exterior. Copper bottom cook wares are used because copper disperses heat fast and help cook food fast and keep the surface heat even. This is because the heat conductivity of copper metal is double that of aluminum metal and is ten times more than the stainless steel. Many cookware products produced nowadays do not serve the purpose perfectly as these types of cookware are not ideal in the material they are made up of and because of pool boiling.
Boiling
In boiling, bubbles carry away large amounts of heat from solid surfaces, but the bubbles also act as an insulator, preventing the liquid from rewetting the surface and thereby interrupting heat transfer. Pool boiling is the most common and familiar method of heat transfer. In this method of heat transfer a critical point will be reached at which a solid surface gets too hot and pool-boiling efficiency is lost.
Heat transfer by nano layer
By adding a nano coating of alumina to the metal surface, researchers at the Georgia Institute of Technology have doubled the rate of heat transfer. The nanoalumina coating has a high affinity to water and, as a result, facilitates the rapid rewetting of the solid surface. Such an atomic layer is made by a deposition technique with controlled thickness. While achieving such a thin coating, the additional layer of alumina does not appreciably increase thermal resistance, but increases the overall heat transfer. Due to the wet ability of surfaces at the nanometer scale heat transfer during pool boiling is greatly increased.
Applications
Researchers claim that this finding has very promising applications and nanotube or nanowire arrays along with nano-coating by atomic layer deposition can be used to enhance pool boiling heat transfer efficiency still further. They feel that it can also be used for advancing thermal management of electronics as well as improving the efficiency of a number of energy systems.